PRODUCT
Polyimide Film - Mordohar PIT
• It offers an excellent combination of thermal conductivity, electrical properties and mechanical toughness for its use in electronic and automotive applications.
• Application
1. Insulation pads (heat sink).
2. Power supplies.
3. Heater circuits.
4. Ceramic board replacement.
Polyimide Film - Mordohar PIA
• As the polymer structure having a high rigidity and strong intermolecular forces, thus has superior chemical, physical, electrical and radiation-resistant properties, especially those having a lower coefficient of thermal expansion, and high rigidity and excellent dimensional stability. They can be applied to various harsh working environment.
• Application
1. Electric magnetic wire and cable coiling, motor slot liners, transformer interlayer insulation.
2. The backing material of pressure-sensitive adhesive tape, F46 (FEP) tape.
3. The substrates of Flexible Printed Circuits Board (F-PCB).
4. Opaque cover-layers, Satellite blankets, Radiant heat absorber.
Polyimide Film - Mordohar PIB/PMB
• It's a kind of heat resistant film possessing excellent physical, chemical, and electrical properties the same as PIF type. Besides, the PIB type offering low light transmission, reflectivity and superior durability.
• Application
1. Opaque cover-layers, Satellite blankets, Radiant heat absorber.
2. Electric magnetic wire and cable coiling, motor slot liners, transformer interlayer insulation.
3. The substrates of Flexible Printed Circuits Board (F-PCB).
4. The adhesive tape is used for IC packing.
Polyimide Film - Mordohar PIN
• it is of atomic radiation resistant. Polyimide film is currently the macromolecular compound with the best combined properties and the highest heat resistant. PIN type have higher modulus and lower CTE than PIF type.
• Application
1. Electric magnetic wire and cable coiling, motor slot liners, transformer interlayer insulation.
2. The backing material of pressure-sensitive adhesive tape, F46 (FEP) tape.
3. The substrates of Flexible Printed Circuits Board (F-PCB).
4. The adhesive tape is used for IC packing.
Polyimide Film - Mordohar PIF
• It performs successfully in the wide range of temperature as low as -452 °F (-269℃) and as high as +436°F (+260℃) and can be exposed at +752°F (+400℃) in short time. Besides, it is of atomic radiation resistant. Polyimide film is currently the macromolecular compound with the best combined properties and the highest heat resistant.
• Application
1. Electric magnetic wire and cable coiling, motor slot liners, transformer interlayer insulation.
2. The backing material of pressure-sensitive adhesive tape, F46 (FEP) tape.
3. The substrates of Flexible Printed Circuits Board (F-PCB).
4.The adhesive tape is used for IC packing.
